Quality & Manufacturing
e-Vehicle develops its products in alignment with the automotive quality standard IATF 16949:2016 and collaborates with supplier partners certified to the same standard. We are actively pursuing IATF 16949:2016 certification to further support product quality, safety, and customer satisfaction.
We also promote environmentally responsible procurement by adopting materials that comply with RoHS requirements (2015/863).
Semiconductor Quality Process
Our team designs automotive ICs to meet AEC-Q100 requirements, supporting operation in demanding environments from −40°C to +150°C.
The KYEC E320BD machine is used for chip probe testing.
Test items include: UserPowerON, Relay_OS, OS, power_short, Relay_RST, A01_IDD_StandBy, A02_IDD_ShutDown, Digital_Start, opif_rd_h02_id_b10099_E/F, ATPG_40MHz_E/F and ATPG_10MHz_E/F.
Packaging options vary by product type:
Control IC: QFN-24
MOSFET: TO-252, TO-220, PDFN5060, PDFN3333
Photocoupler: SO-6, SO-6L, DIP-8, SO-8
The Teradyne FLEX100 machine is used for final testing.
Test items include: ADC_CHK, ATPG_10MHz/40MHz, CHOKE_FUNC, Digital_Start, DutyCycle, FAST_OS, IDD_ShutDown, IDD_StandBy, IG_Vth, LAMP_FUNC, LDO5, LoadDump_Vth, O_S_N_VB, Over_Vth, PHASE_DET, Power_On, power_short, Relay_OS, Relay_RST, RSLS_2PPMU, Scan2Normal, ShortCkt_Vth, Under_Vth, UVLO_Vth and VREF.
Module Quality Process
Module cosmetic inspection follows IPC-A-610 Class 2 criteria.
The DEK-J1761RS(M) machine is used for thick film printing.
Conductive adhesive is printed with a smooth, even surface to support electrical conductivity, adhesion and solder resistance. The silver foil and silver-palladium alloy ratio is adjusted to help the IC withstand low-temperature conditions.
Equipment used in the SMT process includes:
MALCOM PCU-205: Solder paste inspection.
EKRA XH STS: High-accuracy solder paste printing.
TR7006L: Tin thickness measurement.
GAM40U: Helps prevent solder paste from adhering to the back of the stencil.
JUKI KE-2070M: High-speed pick-and-place for production efficiency.
e-Vehicle Semiconductor Technology developed an original dynamic laser trimming machine using CCD (Charge-Coupled Device) image navigation for high-accuracy trimming.
Features:
• Resistor accuracy: ±0.1%
• Automatic F-voltage measurement
• Resistor adjustment estimation
e-Vehicle Semiconductor Technology developed an original voltage regulator tester with self-developed software. It scans barcodes, automatically determines test items, uploads test data to the drive and analyzes results in parallel.
Quality Assurance
Customer satisfaction is supported by APQP (Advanced Product Quality Planning), a core automotive-industry process for evaluating and improving manufacturing processes and reducing potential failure modes.
A focus on advanced product design.
Professional equipment for product development.
Quality processes for dependable results.
Precise methods and rigorous test planning.
品質與製造
e-Vehicle 依循汽車產業品質標準 IATF 16949:2016 開發產品，並與通過相同標準認證的供應商合作。我們也持續推動 IATF 16949:2016 認證，以進一步提升產品品質、安全性與客戶滿意度。
此外，我們採用符合 RoHS 要求（2015/863）的材料，落實環境友善採購。
半導體品質流程
我們依據 AEC-Q100 要求設計車用 IC，支援產品在 −40°C 至 +150°C 的嚴苛環境下運作。
使用 KYEC E320BD 設備進行晶圓針測。
測試項目包含：UserPowerON、Relay_OS、OS、power_short、Relay_RST、A01_IDD_StandBy、A02_IDD_ShutDown、Digital_Start、opif_rd_h02_id_b10099_E/F、ATPG_40MHz_E/F 及 ATPG_10MHz_E/F。
封裝 options vary by product type:
控制 IC：QFN-24
MOSFET：TO-252、TO-220、PDFN5060、PDFN3333
光耦合器：SO-6、SO-6L、DIP-8、SO-8
使用 Teradyne FLEX100 設備進行最終測試。
測試項目包含：ADC_CHK、ATPG_10MHz/40MHz、CHOKE_FUNC、Digital_Start、DutyCycle、FAST_OS、IDD_ShutDown、IDD_StandBy、IG_Vth、LAMP_FUNC、LDO5、LoadDump_Vth、O_S_N_VB、Over_Vth、PHASE_DET、Power_On、power_short、Relay_OS、Relay_RST、RSLS_2PPMU、Scan2Normal、ShortCkt_Vth、Under_Vth、UVLO_Vth 及 VREF。
模組品質流程
模組外觀檢驗依據 IPC-A-610 Class 2 標準執行。
使用 DEK-J1761RS(M) 設備進行厚膜印刷。
將導電膠均勻印刷於表面，以確保導電性、附著力與耐焊性。並調整銀箔與銀鈀合金比例，協助 IC 承受低溫環境。
SMT 製程使用的設備包含：
MALCOM PCU-205：錫膏檢測。
EKRA XH STS：高精度錫膏印刷。
TR7006L：錫厚量測。
GAM40U：避免錫膏沾附於鋼板背面。
JUKI KE-2070M：高速取放元件，提升生產效率。
e-Vehicle Semiconductor Technology 自行開發動態雷射修整設備，採用 CCD（電荷耦合元件）影像導航，實現高精度修整。
特色：
• 電阻精度：±0.1%
• 自動量測 F-voltage
• 電阻調整預估
e-Vehicle Semiconductor Technology 自行開發穩壓器測試設備與軟體，可掃描條碼、自動判定測試項目、上傳測試資料，並同步分析測試結果。
品質保證
我們透過 APQP（先期產品品質規劃）提升客戶滿意度。這是汽車產業的重要流程，用於評估與改善製造流程，並降低潛在失效風險。
專注於先進產品設計。
以專業設備支援產品開發。
透過品質流程確保可靠成果。
採用精準方法與嚴謹測試規劃。
